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18-350000-10 Tech Specifications

Category Adapter, Breakout Boards
Manufacturer Aries Electronics
Factory Lead Time 5 Weeks
Contact Plating Tin
Material FR4 Epoxy Glass
Package Accepted SOIC
Contact Materials Brass
Series Correct-A-Chip® 350000
Published 2006
Size / Dimension 1.800Lx0.450W 45.72mmx11.43mm
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 18Positions
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Number of Rows 2Rows
Additional Feature SOCKET ADAPTER
Pitch 0.050 1.27mm
Number of Contacts 18Contacts
Row Spacing 7.62 mm
Device Socket Type IC SOCKET
Proto Board Type SMD to DIP
Height 1.58mm
Board Thickness 0.062 1.57mm 1/16
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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18-350000-10 Documents

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