24-6556-41 Tech Specifications

Category Sockets for ICs, Transistors
Manufacturer Aries Electronics
Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Packaging Bulk
Series 6556
Published 2006
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder Cup
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 24Positions
Additional Feature STANDARD: UL 94V-0
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Number of Contacts 24Contacts
Lead Length 4.572mm
Termination Post Length 0.180 4.57mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
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