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24-6574-11 Tech Specifications

Category Sockets for ICs, Transistors
Manufacturer Aries Electronics
Factory Lead Time 5 Weeks
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Tin
Contact Materials Copper
Operating Temperature (Max.) 150°C
Packaging Bulk
Series 57
Published 2005
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Number of Positions 24Positions
Additional Feature STANDARD: UL 94V-0
Current Rating (Amps) 1A
Terminal Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 24Contacts
PCB Contact Pattern RECTANGULAR
Body Breadth 0.9 inch
Body Depth 0.47 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 0.6 mm
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Height 11.9mm
Length 45.5mm
Width 22.9mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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24-6574-11 Documents

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