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A-TB500-HG04 Tech Specifications
| Category | Terminal Blocks - Wire to Board | |
| Manufacturer | ASSMANN WSW Components | |
| Factory Lead Time | 23 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Housing Material | Thermoplastic | |
| Contact Material - Plating | Brass | |
| Clamp Material - Plating | Steel, Stainless | |
| Operating Temperature | -30°C~105°C | |
| Packaging | Bulk | |
| Series | A-TB500 | |
| Published | 2010 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Color | Gray | |
| Pitch | 0.197 5.00mm | |
| Wire Gauge | 12-28 AWG | |
| Voltage | 300V | |
| Plating | Steel | |
| Number of Levels | 1Level | |
| Current | 15A | |
| Wire Gauge (Max) | 28 AWG | |
| Wire Gauge (Min) | 12 AWG | |
| Positions Per Level | 4 | |
| Mating Orientation | 45° (135°) Angle with Board | |
| Wire Termination | Screwless | |
| Features | Interlocking (Side) | |
| RoHS Status | ROHS3 Compliant |
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