Atmel (Microchip Technology) M2S050-FGG484 System On Chip
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M2S050-FGG484 Tech Specifications
| Category | Embedded - System On Chip (SoC) | |
| Manufacturer | Atmel | |
| Package / Case | BGA-484 | |
| Embedded Block RAM - EBR | 64 kB | |
| Moisture Sensitive | Yes | |
| Number of Logic Array Blocks - LABs | 4695 LABLogic Array Blocks - LAB | |
| Factory Pack QuantityFactory Pack Quantity | 60 | |
| Distributed RAM | 1.314 Mbit | |
| Maximum Operating Temperature | + 85 C | |
| Minimum Operating Temperature | 0 C | |
| Number of I/Os | 267 I/OI/O | |
| Number of Logic Elements | 56340 LELogic Element | |
| Data RAM Size | 64 kB |
| L1 Cache Data Memory | - | |
| L1 Cache Instruction Memory | - | |
| Maximum Clock Frequency | 166 MHz | |
| Core | ARM Cortex M3 | |
| Mounting Styles | SMD/SMT | |
| RoHS | Details | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| Packaging | Tray | |
| Series | SmartFusion2 | |
| Operating Supply Voltage | 1.2 V | |
| Program Memory Size | 256 kB | |
| Number of Cores | 1 CoreCore |
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