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- HF115AC-0.0055-AC-54
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HF115AC-0.0055-AC-54 Tech Specifications
| Category | Thermal - Pads, Sheets | |
| Manufacturer | Bergquist | |
| Factory Lead Time | 10 Weeks | |
| Material | Phase Change Compound | |
| Shape | Rectangular | |
| Series | Hi-Flow® 115-AC | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Type | Pad, Sheet | |
| Color | Gray |
| Usage | TO-220 | |
| Shelf Life | 6 Months | |
| Adhesive | Adhesive - One Side | |
| Backing, Carrier | Fiberglass | |
| Outline | 19.05mm x 12.70mm | |
| Thermal Conductivity | 0.8W/m-K | |
| Natural Thermal Resistance | 0.35 °C/W | |
| Thickness | 0.0055 0.140mm | |
| RoHS Status | ROHS3 Compliant |
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HF115AC-0.0055-AC-54 Documents
Download datasheets and manufacturer documentation for HF115AC-0.0055-AC-54
- DatasheetsThermal Interface Materials HF115AC-0.0055-AC-54-Bergquist-datasheet-15989705.pdf
- PCN Manufacturer InformationMultiple Devices Manufacture Information 25/Oct/2019
- PCN PackagingHenkel/Berquist Revised Brands 10/May/2016
- Other Related DocumentsThermal Ordering Info Sil-Pad Metric Configurations
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