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- CDSOD323-T24C
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CDSOD323-T24C Tech Specifications
| Category | TVS - Diodes | |
| Manufacturer | Bourns | |
| Factory Lead Time | 7 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-76, SOD-323 | |
| Number of Pins | 2Pins | |
| Diode Element Material | SILICON | |
| Breakdown Voltage / V | 26.7V | |
| Number of Elements | 2 Elements | |
| Reverse Stand-off Voltage | 24V | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Cut Tape (CT) | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Applications | General Purpose | |
| Additional Feature | LOW CAPACITANCE | |
| Capacitance | 1pF | |
| Max Power Dissipation | 350W |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Depth | 1.45mm | |
| Base Part Number | CDSOD323 | |
| Pin Count | 2 | |
| Operating Supply Voltage | 24V | |
| Working Voltage | 24V | |
| Leakage Current | 1μA | |
| Element Configuration | Single | |
| Power Line Protection | No | |
| Current - Peak Pulse (10/1000μs) | 6A 8/20μs | |
| Max Reverse Leakage Current | 3μA | |
| Voltage - Clamping (Max) @ Ipp | 56V Typ | |
| Clamping Voltage | 43V | |
| Peak Pulse Current | 6A | |
| Max Surge Current | 6A | |
| Peak Pulse Power | 350W | |
| Direction | Bidirectional | |
| Test Current | 1mA | |
| Bidirectional Channels | 1 | |
| Capacitance @ Frequency | 3pF @ 1MHz | |
| ESD Protection | Yes | |
| Height | 1mm | |
| Length | 1.9mm | |
| Width | 1.45mm | |
| REACH SVHC | No SVHC | |
| RoHS Status | ROHS3 Compliant |
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CDSOD323-T24C Documents
Download datasheets and manufacturer documentation for CDSOD323-T24C
- DatasheetsCDSOD323-Txx(C) CDSOD323-T24C-Bourns-datasheet-28808730.pdf CDSOD323-T24C-Bourns-datasheet-22084022.pdf CDSOD323-T24C-Bourns-datasheet-13385636.pdf
- PCN Assembly/OriginSemiconductor Warehouse 21/Mar/2019 Mult Dev Wafer Size Chg 24/Sep/2019
- ConflictMineralStatementBourns-company-36.pdf
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