Broadcom Limited BCM5633 Application Specific MCUs
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BCM5633 Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | Broadcom | |
| Surface Mount | YES | |
| Number of Terminals | 785Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | BROADCOM CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Moisture Sensitivity Levels | 1 | |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | |
| Package Shape | UNSPECIFIED | |
| Package Style | GRID ARRAY | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Reach Compliance Code | compliant | |
| Pin Count | 785 | |
| JESD-30 Code | X-PBGA-B785 | |
| Qualification Status | Not Qualified | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
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BCM5633 Documents
Download datasheets and manufacturer documentation for BCM5633
- DatasheetsBRDCS00194-1.pdf
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