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- HCPL-0201-500E
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HCPL-0201-500E Tech Specifications
| Category | Optoisolators - Logic Output | |
| Manufacturer | Broadcom | |
| Factory Lead Time | 22 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Number of Pins | 8Pins | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2010 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Additional Feature | CMOS COMPATIBLE, UL RECOGNIZED | |
| Max Power Dissipation | 210mW | |
| Voltage - Supply | 4.5V~20V | |
| Voltage - Isolation | 3750Vrms | |
| Output Voltage | 20V | |
| Output Type | Push-Pull, Totem Pole | |
| Max Output Current | 25mA | |
| Configuration | SINGLE | |
| Number of Channels | 1Channel | |
| Power Dissipation | 210mW | |
| Output Current | 25mA |
| Voltage - Forward (Vf) (Typ) | 1.5V | |
| Propagation Delay | 300 ns | |
| Input Type | DC | |
| Turn On Delay Time | 300 ns | |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER | |
| Forward Current | 5mA | |
| Data Rate | 5MBd | |
| Direction | Unidirectional | |
| Output Current per Channel | 25mA | |
| Rise Time | 30ns | |
| Fall Time (Typ) | 7 ns | |
| Rise / Fall Time (Typ) | 30ns 7ns | |
| Reverse Breakdown Voltage | 5V | |
| Current - DC Forward (If) (Max) | 10mA | |
| Input Current | 5mA | |
| On-State Current-Max | 0.025A | |
| Propagation Delay tpLH / tpHL (Max) | 300ns, 300ns | |
| Common Mode Transient Immunity (Min) | 1kV/μs | |
| Inputs - Side 1/Side 2 | 1/0 | |
| Max Junction Temperature (Tj) | 125°C | |
| Ambient Temperature Range High | 85°C | |
| Height | 3.607mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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HCPL-0201-500E Documents
Download datasheets and manufacturer documentation for HCPL-0201-500E
- PCN Design/SpecificationMult Device Design Changes 10/Nov/2015 Molding Chg 08/Feb/2016
- PCN PackagingMultiple Devices Marking/Labeling 07/Aug/2013 Marking/Labeling Revision B 14/Jan/2014
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