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- HSMP-386J-BLKG
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HSMP-386J-BLKG Tech Specifications
| Category | Diodes - RF | |
| Manufacturer | Broadcom | |
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Number of Pins | 8Pins | |
| Diode Element Material | SILICON | |
| Number of Elements | 8 Elements | |
| Operating Temperature | 150°C TJ | |
| Packaging | Bulk | |
| Published | 2006 | |
| JESD-609 Code | e3 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Type | Switch | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | LOW DISTORTION |
| Terminal Position | DUAL | |
| Configuration | COMPLEX | |
| Max Current Rating | 1A | |
| Diode Type | PIN - 4 Pair Parallel | |
| Power Dissipation | 2W | |
| Forward Current | 1A | |
| Capacitance @ Vr, F | 1.25pF @ 50V 1MHz | |
| Reverse Voltage | 100V | |
| Voltage - Peak Reverse (Max) | 100V | |
| Frequency Band | L B | |
| Diode Capacitance-Nom | 1.2pF | |
| Resistance @ If, F | 770mOhm @ 50mA 100MHz | |
| Diode Capacitance-Max | 1.25pF | |
| Minority Carrier Lifetime-Nom | 0.26 μs | |
| Diode Res Test Current | 50mA | |
| Diode Res Test Frequency | 100MHz | |
| Diode Forward Resistance-Max | 0.77Ohm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
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HSMP-386J-BLKG Documents
Download datasheets and manufacturer documentation for HSMP-386J-BLKG
- PCN Obsolescence/ EOLMult Devices EOL 01/Dec/2017
- PCN PackagingMult Devices Packing 25/Apr/2018 Alternate ESD Lock Reel Supplier 24/Jul/2014
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