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PEX8114-BD13BI G Tech Specifications

Category Interface - Specialized
Manufacturer Broadcom
Factory Lead Time 22 Weeks
Mounting Type Surface Mount
Surface Mount YES
Supplier Device Package 256-BGA (17x17)
Operating Temperature (Max.) 85°C
Operating Temperature (Min.) -40°C
Packaging Tray
Series ExpressLane™
Published 2008
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Applications PCI-to-PCI Bridge
HTS Code 8542.31.00.01
Voltage - Supply 3.3V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Power Supplies 13.3V
Temperature Grade INDUSTRIAL
Interface PCI
Bus Compatibility ISA; SPI; VGA
Data Transfer Rate-Max 312.5 MBps
Length 17mm
Height Seated (Max) 1.76mm
Width 17mm
RoHS Status ROHS3 Compliant
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PEX8114-BD13BI G Documents

Download datasheets and manufacturer documentation for   PEX8114-BD13BI G

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