Chip Quik Inc. IPC0106-S
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IPC0106-S Tech Specifications
| Category | Solder Stencils, Templates | |
| Manufacturer | Chip Quik | |
| Material | Stainless Steel | |
| Series | Proto-Advantage IPC | |
| Published | 2014 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Type | DFN |
| Number of Positions | 14Positions | |
| Pitch | 0.020 0.50mm | |
| Outer Dimension | 1.300 L x 0.900 W (33.02mm x 22.86mm) | |
| Thermal Center Pad | 0.118 L x 0.102 W (3.00mm x 2.60mm) | |
| Thickness | 0.0040 0.102mm | |
| Diameter - Inner | 0.157 L x 0.157 W (4.00mm x 4.00mm) | |
| RoHS Status | ROHS3 Compliant |
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IPC0106-S Documents
Download datasheets and manufacturer documentation for IPC0106-S
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