PA0011C Tech Specifications

Category Solderless Breadboards
Manufacturer Chip Quik
Material FR4 Epoxy Glass
Package Accepted SOIC
RoHS Details
Contact Materials Gold
Spacing 5.5 mm
Package Bulk
Base Product Number PA0011
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 1.400 L x 0.700 W (35.56mm x 17.78mm)
Type SOIC-28 to DIP-28 SMT Adapter
Number of Positions 28Positions
Pitch 0.050 (1.27mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 35.56 mm
Width 17.78 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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