Chip Quik, Inc. PA0042C Solderless Breadboards
0.400 L x 0.400 W (10.16mm x 10.16mm)
IN STOCK
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PA0042C Tech Specifications
| Category | Solderless Breadboards | |
| Manufacturer | Chip Quik | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | VSSOP | |
| RoHS | Details | |
| Contact Materials | Gold | |
| Spacing | 1.7 mm | |
| Package | Bulk | |
| Base Product Number | PA0042 | |
| Mfr | Chip Quik Inc. | |
| Product Status | Active |
| Series | Proto-Advantage | |
| Size / Dimension | 0.400 L x 0.400 W (10.16mm x 10.16mm) | |
| Type | VSSOP-8 to DIP-8 SMT Adapter | |
| Number of Positions | 8Positions | |
| Pitch | 0.020 (0.50mm) | |
| Proto Board Type | SMD to DIP | |
| Product | Surface Mount Adapter | |
| Length | 10.16 mm | |
| Width | 10.16 mm | |
| Height | 1.6 mm | |
| Board Thickness | 0.063 (1.60mm) |
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