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CMX602BD4 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | CML Microcircuits | |
Factory Lead Time | 10 Weeks | |
Surface Mount | YES | |
Package / Case | 16-TSSOP (0.173, 4.40mm Width) | |
Mounting Type | Surface Mount | |
Published | 1998 | |
Operating Temperature | -40°C~85°C | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Obsolete | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 16Terminations | |
Terminal Finish | Matte Tin (Sn) | |
Power (Watts) | 800mW |
Voltage - Supply | 2.7V~5.5V | |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Peak Reflow Temperature (Cel) | 260 | |
Supply Voltage | 3V | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Function | Calling Line Identifier | |
Qualification Status | Not Qualified | |
Number of Circuits | 1Circuit | |
Current - Supply | 2mA | |
Telecom IC Type | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | |
Width | 7.425mm | |
Height Seated (Max) | 2.67mm | |
RoHS Status | ROHS3 Compliant |
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