CMX868D2 Tech Specifications

Category Interface - Telecom
Manufacturer CML Microcircuits
Surface Mount YES
Number of Terminals 24Terminals
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer CML MICROCIRCUITS LTD
Part Package Code SOIC
Package Description SOP, SOP24,.4
Date Of Intro 1999-07-14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP24,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Supply Voltage-Nom 3 V
JESD-609 Code e3
Pbfree Code Yes
Terminal Finish Matte Tin (Sn)
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 24
JESD-30 Code R-PDSO-G24
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Data Rate 2 Mbps
Seated Height-Max 2.67 mm
Telecom IC Type MODEM
Length 15.365 mm
Width 7.425 mm
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CMX868D2 Documents

Download datasheets and manufacturer documentation for   CMX868D2

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