CML Microcircuits Plc FX469P6 Telecom Interface ICs
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FX469P6 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Micro Crystal | |
| Surface Mount | NO | |
| Number of Terminals | 22Terminals | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CML MICROCIRCUITS LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP22,.4 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP22,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Nom | 5 V |
| Additional Feature | FULL DUPLEX | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 22 | |
| JESD-30 Code | R-PDIP-T22 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| Data Rate | 4 Mbps | |
| Seated Height-Max | 4.95 mm | |
| Telecom IC Type | MODEM | |
| Length | 27.685 mm | |
| Width | 10.16 mm |
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FX469P6 Documents
Download datasheets and manufacturer documentation for FX469P6
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