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- APF30-30-10CB
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APF30-30-10CB Tech Specifications
| Category | Thermal - Heat Sinks | |
| Manufacturer | CTS | |
| Contact Plating | Tin | |
| Mount | Through Hole | |
| Number of Pins | 2Pins | |
| Material | Aluminum Alloy | |
| Dielectric Material | PP | |
| Voltage, Rating | 1 kV | |
| Voltage Rating (DC) | 1 kV | |
| Voltage Rating (AC) | 400 V | |
| RoHS | Compliant | |
| Device Cooled | BGA | |
| Mounting | Adhesive Mount | |
| Fin Style | Forged | |
| Mounting Styles | SMD/SMT | |
| Designed for | BGA, PGA, PLCC, QFP | |
| Series | APF | |
| Tolerance | 5 % |
| Termination | Radial | |
| Type | Passive | |
| Max Operating Temperature | 105 °C | |
| Min Operating Temperature | -55 °C | |
| Capacitance | 22 nF | |
| Lead Pitch | 22.5 mm | |
| Dielectric | PP | |
| Attachment Method | Adhesive Tape | |
| Product | Heat Sinks | |
| Product Length | 30 mm | |
| Thermal Resistance | 3.3 °C/W | |
| Width | 6.5024 mm | |
| Height | 19.5 mm | |
| Length | 26.0096 mm | |
| Height Seated (Max) | 19.5072 mm | |
| REACH SVHC | Unknown | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
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