CUI Devices HSB01-080808 Heat Sinks 39.10°C/W 16.00°C/W @ 200 LFM

Mfr. Part # : HSB01-080808

Elecinsight Part # : 589-388-HSB01-080808

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 1.9W @ 75°C, Thermal Resistance @ Natural: 39.10°C/W, Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM

IN STOCK : 255

Min. : 1 Mult. : 1

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HSB01-080808 brand manufacturers: CUI Devices, Elecinsight stock, HSB01-080808 reference price.CUI Devices. HSB01-080808 parameters, HSB01-080808 Datasheet PDF and pin diagram description download.You can use the HSB01-080808 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB01-080808 pin diagram and circuit diagram and usage method of function,HSB01-080808 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Designed for	BGA
Mounting Styles	Adhesive
Heatsink Material	Aluminum Alloy
Fin Style	Vertical Fin
Factory Pack QuantityFactory Pack Quantity	3672
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSB
Type	Top Mount
Color	Black
Attachment Method	Adhesive
Thermal Resistance @ Forced Air Flow	16.00°C/W @ 200 LFM
Thermal Resistance @ Natural	39.10°C/W
Power Dissipation @ Temperature Rise	1.9W @ 75°C
Product	Heatsinks
Thermal Resistance	43.3 C/W
Length	8.5 mm
Width	8.5 mm
Height	8 mm
Diameter	-

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CUI Devices HSB01-080808 Heat Sinks 39.10°C/W 16.00°C/W @ 200 LFM

HSB01-080808 Tech Specifications

CUI Devices HSB01-080808 Heat Sinks 39.10°C/W 16.00°C/W @ 200 LFM WISH LIST Compare

HSB01-080808 Tech Specifications

CUI Devices HSB01-080808 Heat Sinks 39.10°C/W 16.00°C/W @ 200 LFM