CUI Devices HSB05-171711 Heat Sinks 8.40°C/W @ 200 LFM 23.91°C/W

Mfr. Part # : HSB05-171711

Elecinsight Part # : 589-388-HSB05-171711

RoHS : RoHS Compliant

Datasheet :

Description : Thermal Resistance @ Forced Air Flow: 8.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.91°C/W, Power Dissipation @ Temperature Rise: 3.1W @ 75°C

IN STOCK : 818

Min. : 1 Mult. : 1

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HSB05-171711 brand manufacturers: CUI Devices, Elecinsight stock, HSB05-171711 reference price.CUI Devices. HSB05-171711 parameters, HSB05-171711 Datasheet PDF and pin diagram description download.You can use the HSB05-171711 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB05-171711 pin diagram and circuit diagram and usage method of function,HSB05-171711 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Designed for	BGA
Mounting Styles	Adhesive
Heatsink Material	Aluminum Alloy
Fin Style	Vertical Fin
Factory Pack QuantityFactory Pack Quantity	1960
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSB
Type	Top Mount
Color	Black
Attachment Method	Adhesive
Thermal Resistance @ Forced Air Flow	8.40°C/W @ 200 LFM
Thermal Resistance @ Natural	23.91°C/W
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Product	Heatsinks
Thermal Resistance	29.1 C/W
Length	17 mm
Width	17 mm
Height	11.5 mm
Diameter	-

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CUI Devices HSB05-171711 Heat Sinks 8.40°C/W @ 200 LFM 23.91°C/W

HSB05-171711 Tech Specifications

CUI Devices HSB05-171711 Heat Sinks 8.40°C/W @ 200 LFM 23.91°C/W WISH LIST Compare

HSB05-171711 Tech Specifications

CUI Devices HSB05-171711 Heat Sinks 8.40°C/W @ 200 LFM 23.91°C/W