CUI Devices HSB10-232306 Heat Sinks 9.60°C/W @ 200 LFM 25.46°C/W

Mfr. Part # : HSB10-232306

Elecinsight Part # : 589-388-HSB10-232306

RoHS : RoHS Compliant

Datasheet :

Description : Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.46°C/W, Power Dissipation @ Temperature Rise: 3.0W @ 75°C

IN STOCK : 318

Min. : 1 Mult. : 1

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HSB10-232306 brand manufacturers: CUI Devices, Elecinsight stock, HSB10-232306 reference price.CUI Devices. HSB10-232306 parameters, HSB10-232306 Datasheet PDF and pin diagram description download.You can use the HSB10-232306 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB10-232306 pin diagram and circuit diagram and usage method of function,HSB10-232306 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Designed for	BGA
Mounting Styles	Adhesive
Heatsink Material	Aluminum Alloy
Fin Style	Vertical Fin
Factory Pack QuantityFactory Pack Quantity	1872
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSB
Type	Top Mount
Color	Black
Attachment Method	Adhesive
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 200 LFM
Thermal Resistance @ Natural	25.46°C/W
Power Dissipation @ Temperature Rise	3.0W @ 75°C
Product	Heatsinks
Thermal Resistance	29.2 C/W
Length	23 mm
Width	23 mm
Height	6 mm
Diameter	-

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CUI Devices HSB10-232306 Heat Sinks 9.60°C/W @ 200 LFM 25.46°C/W

HSB10-232306 Tech Specifications

CUI Devices HSB10-232306 Heat Sinks 9.60°C/W @ 200 LFM 25.46°C/W WISH LIST Compare

HSB10-232306 Tech Specifications

CUI Devices HSB10-232306 Heat Sinks 9.60°C/W @ 200 LFM 25.46°C/W