CUI Devices HSB11-252518 Heat Sinks 13.70°C/W 4.50°C/W @ 200 LFM

Mfr. Part # : HSB11-252518

Elecinsight Part # : 589-388-HSB11-252518

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 5.5W @ 75°C, Thermal Resistance @ Natural: 13.70°C/W, Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM

IN STOCK : 1868

Min. : 1 Mult. : 1

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HSB11-252518 brand manufacturers: CUI Devices, Elecinsight stock, HSB11-252518 reference price.CUI Devices. HSB11-252518 parameters, HSB11-252518 Datasheet PDF and pin diagram description download.You can use the HSB11-252518 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB11-252518 pin diagram and circuit diagram and usage method of function,HSB11-252518 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Designed for	BGA
Mounting Styles	Adhesive
Heatsink Material	Aluminum Alloy
Fin Style	Vertical Fin
Factory Pack QuantityFactory Pack Quantity	1408
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSB
Type	Top Mount
Color	Black
Attachment Method	Adhesive
Thermal Resistance @ Forced Air Flow	4.50°C/W @ 200 LFM
Thermal Resistance @ Natural	13.70°C/W
Power Dissipation @ Temperature Rise	5.5W @ 75°C
Product	Heatsinks
Thermal Resistance	16.8 C/W
Length	25 mm
Width	25 mm
Height	18 mm
Diameter	-

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CUI Devices HSB11-252518 Heat Sinks 13.70°C/W 4.50°C/W @ 200 LFM

HSB11-252518 Tech Specifications

CUI Devices HSB11-252518 Heat Sinks 13.70°C/W 4.50°C/W @ 200 LFM WISH LIST Compare

HSB11-252518 Tech Specifications

CUI Devices HSB11-252518 Heat Sinks 13.70°C/W 4.50°C/W @ 200 LFM