CUI Devices HSB17-404025 Heat Sinks 6.41°C/W 2.10°C/W @ 200 LFM

Mfr. Part # : HSB17-404025

Elecinsight Part # : 589-388-HSB17-404025

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 11.7W @ 75°C, Thermal Resistance @ Natural: 6.41°C/W, Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM

IN STOCK : 191

Min. : 1 Mult. : 1

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HSB17-404025 brand manufacturers: CUI Devices, Elecinsight stock, HSB17-404025 reference price.CUI Devices. HSB17-404025 parameters, HSB17-404025 Datasheet PDF and pin diagram description download.You can use the HSB17-404025 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB17-404025 pin diagram and circuit diagram and usage method of function,HSB17-404025 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Designed for	BGA
Mounting Styles	Adhesive
Heatsink Material	Aluminum Alloy
Fin Style	Vertical Fin
Factory Pack QuantityFactory Pack Quantity	1280
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSB
Type	Top Mount
Color	Black
Attachment Method	Adhesive
Thermal Resistance @ Forced Air Flow	2.10°C/W @ 200 LFM
Thermal Resistance @ Natural	6.41°C/W
Power Dissipation @ Temperature Rise	11.7W @ 75°C
Product	Heatsinks
Thermal Resistance	9 C/W
Length	40 mm
Width	40 mm
Height	25 mm
Diameter	-

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CUI Devices HSB17-404025 Heat Sinks 6.41°C/W 2.10°C/W @ 200 LFM

HSB17-404025 Tech Specifications

CUI Devices HSB17-404025 Heat Sinks 6.41°C/W 2.10°C/W @ 200 LFM WISH LIST Compare

HSB17-404025 Tech Specifications

CUI Devices HSB17-404025 Heat Sinks 6.41°C/W 2.10°C/W @ 200 LFM