HSB32-232318 Tech Specifications

Category Thermal - Heat Sinks
Manufacturer CUI Devices
Material aluminium
Type of heatsink extruded
Heatsink shape grilled
Colour black
Material finishing anodized
Mounting for back plate
Thermal resistance @200 LFM 4.4°C/W
Plate thickness 1.5mm
Gross weight 14.2 g
Thermal resistance max. 17.2°C/W
Length 23mm
Width 23mm
Height 18mm
Select at least one checkbox above to show similar products in this category.
View Similar
HSB32-232318 brand manufacturers: CUI Devices, Elecinsight stock, HSB32-232318 reference price.CUI Devices. HSB32-232318 parameters, HSB32-232318 Datasheet PDF and pin diagram description download.You can use the HSB32-232318 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB32-232318 pin diagram and circuit diagram and usage method of function,HSB32-232318 electronics tutorials.You can download from the Elecinsight.