HSB33-272710 Tech Specifications

Category Thermal - Heat Sinks
Manufacturer CUI Devices
Material aluminium
Type of heatsink extruded
Heatsink shape grilled
Colour black
Material finishing anodized
Mounting for back plate
Thermal resistance @200 LFM 5.3°C/W
Plate thickness 1.5mm
Gross weight 6.25 g
Thermal resistance max. 20.7°C/W
Length 27mm
Width 27mm
Height 10mm
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