CUI Devices HSB37-404023 Heat Sinks 6.43°C/W 2.10°C/W @ 200 LFM

Mfr. Part # : HSB37-404023

Elecinsight Part # : 589-388-HSB37-404023

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 11.7W @ 75°C, Thermal Resistance @ Natural: 6.43°C/W, Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM

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HSB37-404023 Documents

Download datasheets and manufacturer documentation for HSB37-404023

Datasheets
hsb37-404023.pdf

HSB37-404023 brand manufacturers: CUI Devices, Elecinsight stock, HSB37-404023 reference price.CUI Devices. HSB37-404023 parameters, HSB37-404023 Datasheet PDF and pin diagram description download.You can use the HSB37-404023 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB37-404023 pin diagram and circuit diagram and usage method of function,HSB37-404023 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Pin Fins
Package Cooled	BGA
Material Finish	Black Anodized
Mfr	CUI Devices
Fin Height	0.905" (23.00mm)
Series	HSB

Packaging	Box
Part Status	Active
Type	Top Mount
Attachment Method	Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow	2.10°C/W @ 200 LFM
Thermal Resistance @ Natural	6.43°C/W
Power Dissipation @ Temperature Rise	11.7W @ 75°C
Length	1.575" (40.00mm)
Width	1.575" (40.00mm)

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CUI Devices HSB37-404023 Heat Sinks 6.43°C/W 2.10°C/W @ 200 LFM

HSB37-404023 Tech Specifications

HSB37-404023 Documents

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HSB37-404023 Tech Specifications

HSB37-404023 Documents

CUI Devices HSB37-404023 Heat Sinks 6.43°C/W 2.10°C/W @ 200 LFM