HSB38-707025P Tech Specifications

Category Thermal - Heat Sinks
Manufacturer CUI Devices
Material aluminium
Type of heatsink extruded
Heatsink shape grilled
Colour black
Material finishing anodized
Mounting retaining spring
Thermal resistance @200 LFM 1.2°C/W
Plate thickness 4.5mm
Gross weight 119.05 g
Thermal resistance max. 4.2°C/W
Length 69.7mm
Width 69.7mm
Height 25mm
Select at least one checkbox above to show similar products in this category.
View Similar
HSB38-707025P brand manufacturers: CUI Devices, Elecinsight stock, HSB38-707025P reference price.CUI Devices. HSB38-707025P parameters, HSB38-707025P Datasheet PDF and pin diagram description download.You can use the HSB38-707025P Thermal - Heat Sinks, DSP Datesheet PDF, find HSB38-707025P pin diagram and circuit diagram and usage method of function,HSB38-707025P electronics tutorials.You can download from the Elecinsight.