HSB45-383818 Tech Specifications

Category Thermal - Heat Sinks
Manufacturer CUI Devices
Material copper
Type of heatsink extruded
Heatsink shape grilled
Colour natural
Material finishing raw
Mounting for back plate
Thermal resistance @200 LFM 2.9°C/W
Plate thickness 2.2mm
Gross weight 71.88 g
Thermal resistance max. 13.5°C/W
Length 38.1mm
Width 38.1mm
Height 18mm
Select at least one checkbox above to show similar products in this category.
View Similar
HSB45-383818 brand manufacturers: CUI Devices, Elecinsight stock, HSB45-383818 reference price.CUI Devices. HSB45-383818 parameters, HSB45-383818 Datasheet PDF and pin diagram description download.You can use the HSB45-383818 Thermal - Heat Sinks, DSP Datesheet PDF, find HSB45-383818 pin diagram and circuit diagram and usage method of function,HSB45-383818 electronics tutorials.You can download from the Elecinsight.