CUI Devices HSE09-755028 Heat Sinks 5.66°C/W 2.50°C/W @ 200 LFM

Mfr. Part # : HSE09-755028

Elecinsight Part # : 589-388-HSE09-755028

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 13.26W @ 75°C, Thermal Resistance @ Natural: 5.66°C/W, Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM

IN STOCK : 788

Min. : 1 Mult. : 1

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HSE09-755028 brand manufacturers: CUI Devices, Elecinsight stock, HSE09-755028 reference price.CUI Devices. HSE09-755028 parameters, HSE09-755028 Datasheet PDF and pin diagram description download.You can use the HSE09-755028 Thermal - Heat Sinks, DSP Datesheet PDF, find HSE09-755028 pin diagram and circuit diagram and usage method of function,HSE09-755028 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Rectangular, Angled Fins
Package Cooled	TO-218, TO-220
Material Finish	Black Anodized
RoHS	Details
Designed for	TO-220, TO-218
Mounting Styles	PCB
Heatsink Material	Aluminum
Fin Style	Angled Fin
Factory Pack QuantityFactory Pack Quantity	200
Mfr	CUI Devices
Product Status	Active

Package	Bag
Series	HSE
Type	Extruded Heatsink
Color	Black
Attachment Method	Clip
Thermal Resistance @ Forced Air Flow	2.50°C/W @ 200 LFM
Thermal Resistance @ Natural	5.66°C/W
Power Dissipation @ Temperature Rise	13.26W @ 75°C
Product	Heatsinks
Thermal Resistance	5.2 C/W
Length	70 mm
Width	50 mm
Height	28 mm
Diameter	-

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CUI Devices HSE09-755028 Heat Sinks 5.66°C/W 2.50°C/W @ 200 LFM

HSE09-755028 Tech Specifications

CUI Devices HSE09-755028 Heat Sinks 5.66°C/W 2.50°C/W @ 200 LFM WISH LIST Compare

HSE09-755028 Tech Specifications

CUI Devices HSE09-755028 Heat Sinks 5.66°C/W 2.50°C/W @ 200 LFM