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- HSE-B1711-057
CUI Devices HSE-B1711-057 Heat Sinks
7.07°C/W @ 200 LFM 24.19°C/W
IN STOCK
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Mult. : 1
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HSE-B1711-057 Tech Specifications
| Category | Thermal - Heat Sinks | |
| Manufacturer | CUI Devices | |
| Factory Lead Time | 11 Weeks | |
| Material | Aluminum Alloy | |
| Shape | Rectangular, Fins | |
| Package Cooled | TO-220 | |
| Material Finish | Black Anodized | |
| Series | HSE | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Board Level | |
| Attachment Method | Bolt On | |
| Height Off Base (Height of Fin) | 0.354 9.00mm | |
| Thermal Resistance @ Forced Air Flow | 7.07°C/W @ 200 LFM | |
| Thermal Resistance @ Natural | 24.19°C/W | |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C | |
| Length | 0.984 25.00mm | |
| Width | 0.625 16.00mm | |
| RoHS Status | RoHS Compliant |
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HSE-B1711-057 Documents
Download datasheets and manufacturer documentation for HSE-B1711-057
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