CUI Devices HSS01-B20-CP Heat Sinks 3.70°C/W @ 200 LFM 7.59°C/W

Mfr. Part # : HSS01-B20-CP

Elecinsight Part # : 589-388-HSS01-B20-CP

RoHS : RoHS Compliant

Datasheet :

Description : Thermal Resistance @ Forced Air Flow: 3.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.59°C/W, Power Dissipation @ Temperature Rise: 9.9W @ 75°C

IN STOCK : 577

Min. : 1 Mult. : 1

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HSS01-B20-CP brand manufacturers: CUI Devices, Elecinsight stock, HSS01-B20-CP reference price.CUI Devices. HSS01-B20-CP parameters, HSS01-B20-CP Datasheet PDF and pin diagram description download.You can use the HSS01-B20-CP Thermal - Heat Sinks, DSP Datesheet PDF, find HSS01-B20-CP pin diagram and circuit diagram and usage method of function,HSS01-B20-CP electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Rectangular
Package Cooled	TO-220
Material Finish	Black Anodized
Designed for	TO-220
Mounting Styles	PCB Mount
Heatsink Material	Aluminum Alloy
Fin Style	Formed Fin
Factory Pack QuantityFactory Pack Quantity	500
Package	Box
Mfr	CUI Devices
Product Status	Active

Series	HSS
Type	Board Level, Vertical
Color	Black
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Forced Air Flow	3.70°C/W @ 200 LFM
Thermal Resistance @ Natural	7.59°C/W
Power Dissipation @ Temperature Rise	9.9W @ 75°C
Product	Heatsinks
Thermal Resistance	10.6 C/W
Length	49.31 mm
Width	48.26 mm
Height	24.13 mm
Diameter	-

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CUI Devices HSS01-B20-CP Heat Sinks 3.70°C/W @ 200 LFM 7.59°C/W

HSS01-B20-CP Tech Specifications

CUI Devices HSS01-B20-CP Heat Sinks 3.70°C/W @ 200 LFM 7.59°C/W WISH LIST Compare

HSS01-B20-CP Tech Specifications

CUI Devices HSS01-B20-CP Heat Sinks 3.70°C/W @ 200 LFM 7.59°C/W