CUI Devices HSS25-B20-P51 Heat Sinks 12.75°C/W 6.30°C/W @ 200 LFM

Mfr. Part # : HSS25-B20-P51

Elecinsight Part # : 589-388-HSS25-B20-P51

RoHS : RoHS Compliant

Datasheet :

Description : Power Dissipation @ Temperature Rise: 5.88W @ 75°C, Thermal Resistance @ Natural: 12.75°C/W, Thermal Resistance @ Forced Air Flow: 6.30°C/W @ 200 LFM

IN STOCK : 50

Min. : 1 Mult. : 1

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HSS25-B20-P51 brand manufacturers: CUI Devices, Elecinsight stock, HSS25-B20-P51 reference price.CUI Devices. HSS25-B20-P51 parameters, HSS25-B20-P51 Datasheet PDF and pin diagram description download.You can use the HSS25-B20-P51 Thermal - Heat Sinks, DSP Datesheet PDF, find HSS25-B20-P51 pin diagram and circuit diagram and usage method of function,HSS25-B20-P51 electronics tutorials.You can download from the Elecinsight.

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Category	Thermal - Heat Sinks
Manufacturer	CUI Devices
Material	Aluminum Alloy
Shape	Square, Fins
Package Cooled	TO-218, TO-220
Material Finish	Black Anodized
RoHS	Details
Mounting Styles	PCB
Heatsink Material	Aluminum
Fin Style	Extruded Axial Fin
Package	Box
Mfr	CUI Devices
Product Status	Active
Designed for	TO-220

Series	HSS
Type	Stamped Heatsink
Color	Black
Attachment Method	PC Pin
Thermal Resistance @ Forced Air Flow	6.30°C/W @ 200 LFM
Thermal Resistance @ Natural	12.75°C/W
Power Dissipation @ Temperature Rise	5.88W @ 75°C
Product	Heatsinks
Thermal Resistance	16.2 C/W
Length	42.5 mm
Width	25.4 mm
Height	25.4 mm
Diameter	-

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CUI Devices HSS25-B20-P51 Heat Sinks 12.75°C/W 6.30°C/W @ 200 LFM

HSS25-B20-P51 Tech Specifications

CUI Devices HSS25-B20-P51 Heat Sinks 12.75°C/W 6.30°C/W @ 200 LFM WISH LIST Compare

HSS25-B20-P51 Tech Specifications

CUI Devices HSS25-B20-P51 Heat Sinks 12.75°C/W 6.30°C/W @ 200 LFM