CUI Devices HSS-B20-NP Heat Sinks
18.63°C/W 5.01°C/W @ 200 LFM
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HSS-B20-NP Tech Specifications
| Category | Thermal - Heat Sinks | |
| Manufacturer | CUI Devices | |
| Factory Lead Time | 11 Weeks | |
| Material | Aluminum | |
| Shape | Rectangular, Fins | |
| Package Cooled | TO-220 | |
| Material Finish | Black Anodized | |
| Series | HSS | |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable | |
| Type | Board Level | |
| Height Off Base (Height of Fin) | 0.500 12.70mm | |
| Thermal Resistance @ Forced Air Flow | 5.01°C/W @ 200 LFM | |
| Thermal Resistance @ Natural | 18.63°C/W | |
| Power Dissipation @ Temperature Rise | 4.0W @ 75°C | |
| Length | 1.500 38.10mm | |
| Width | 0.504 12.80mm | |
| RoHS Status | RoHS Compliant |
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HSS-B20-NP Documents
Download datasheets and manufacturer documentation for HSS-B20-NP
- DatasheetsHSS-B20-01 Series Datasheet
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