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S29GL032M10FFIR2 Tech Specifications

Category Memory - Modules
Manufacturer Cypress
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Package Description LBGA, BGA64,8X8,40
Access Time-Max 100 ns
Moisture Sensitivity Levels 3
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e1
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN SILVER COPPER
Additional Feature IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.06 mA
Organization 2MX16
Seated Height-Max 1.4 mm
Memory Width 16
Standby Current-Max 0.000005 A
Memory Density 33554432 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 64Sectors/Sizes
Sector Size 64K
Page Size 4/8 words
Ready/Busy YES
Common Flash Interface YES
Length 13 mm
Width 11 mm
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