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- CY14B108N-ZSP45XI
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CY14B108N-ZSP45XI Tech Specifications
| Category | Memory | |
| Manufacturer | Cypress | |
| Factory Lead Time | 12 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 54-TSOP (0.400, 10.16mm Width) | |
| Number of Pins | 54Pins | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 54Terminations | |
| ECCN Code | 3A991.B.2.A | |
| Max Power Dissipation | 1W | |
| Voltage - Supply | 2.7V~3.6V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Terminal Pitch | 0.8mm | |
| Frequency | 1MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | CY14B108 | |
| Pin Count | 54 | |
| Operating Supply Voltage | 3V | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Supply Voltage-Min (Vsup) | 2.7V | |
| Memory Size | 8Mb 512K x 16 | |
| Nominal Supply Current | 57mA | |
| Logic Function | Clock | |
| Memory Format | NVSRAM | |
| Memory Interface | Parallel | |
| Data Bus Width | 16b | |
| Organization | 512KX16 | |
| Write Cycle Time - Word, Page | 45ns | |
| Address Bus Width | 19b | |
| Density | 8 Mb | |
| Standby Current-Max | 0.01A | |
| Access Time (Max) | 45 ns | |
| Word Size | 16b | |
| Time Format | HH:MM:SS | |
| Height | 1.05mm | |
| Length | 22.52mm | |
| Width | 10.262mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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CY14B108N-ZSP45XI Documents
Download datasheets and manufacturer documentation for CY14B108N-ZSP45XI
- DatasheetsCY14B108(L,N) Datasheet CY14B108L,N
- PCN Assembly/OriginQualification Advance Notice 20/May/2016
- PCN PackagingShip Label/Document Standardization 24/Jan/2018
- Environmental InformationRoHS3 Certificate
- PCN Design/SpecificationErrata Update 26/Sep/2014
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