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- FM16W08-SG
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FM16W08-SG Tech Specifications
Category | Memory | |
Manufacturer | Cypress | |
Factory Lead Time | 6 Weeks | |
Contact Plating | Tin | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 28-SOIC (0.295, 7.50mm Width) | |
Number of Pins | 28Pins | |
Memory Types | Non-Volatile | |
Operating Temperature | -40°C~85°C TA | |
Packaging | Tube | |
Series | F-RAM™ | |
Published | 2009 | |
JESD-609 Code | e3 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 28Terminations | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Voltage - Supply | 2.7V~5.5V | |
Terminal Position | DUAL | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Supply Voltage | 3.3V | |
Terminal Pitch | 1.27mm |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Base Part Number | FM16W08 | |
Pin Count | 28 | |
Operating Supply Voltage | 3.3V | |
Supply Voltage-Max (Vsup) | 5.5V | |
Power Supplies | 3/5V | |
Supply Voltage-Min (Vsup) | 2.7V | |
Memory Size | 64Kb 8K x 8 | |
Nominal Supply Current | 12mA | |
Access Time | 70 ns | |
Memory Format | FRAM | |
Memory Interface | Parallel | |
Data Bus Width | 8b | |
Organization | 8KX8 | |
Memory Width | 8 | |
Write Cycle Time - Word, Page | 130ns | |
Density | 64 kb | |
Standby Current-Max | 0.00005A | |
Word Size | 8b | |
Ambient Temperature Range High | 85°C | |
Height | 2.67mm | |
Length | 17.9mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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FM16W08-SG Documents
Download datasheets and manufacturer documentation for FM16W08-SG
- DatasheetsFM16W08
- PCN Design/SpecificationDatasheet Update 27/Feb/2014 F-FRAM Marking Changes 30/Aug/2013
- PCN PackagingShip Label/Document Standardization 24/Jan/2018
- PCN Assembly/OriginQualification Passivation Layer 22/Mar/2014
- PCN OtherMSL Standardization 15/Dec/2014
- Environmental InformationRoHS3 Certificate
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