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MB89925PF-G-132-BND Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Cypress
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 80-BQFP
Number of Pins 80Pins
Supplier Device Package 80-PQFP (14x20)
Data Converters A/D 8x10b
Memory Types Mask ROM
Number of I/Os 69I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series F2MC-8L MB89920
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Frequency 8MHz
Interface Serial, UART, USART
Memory Size 16kB
Oscillator Type External
Speed 8MHz
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.2V~6V
Core Processor F2MC-8L
Peripherals LCD, LVD, POR, PWM, WDT
Program Memory Type Mask ROM
Core Size 8-Bit
Program Memory Size 16KB 16K x 8
Connectivity Serial I/O, UART/USART
RoHS Status ROHS3 Compliant
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MB89925PF-G-132-BND Documents

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