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MB89945PF-G-112-BND Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Cypress
Factory Lead Time 26 Weeks
Package / Case 48-BQFP
Mounting Type Surface Mount
Number of Pins 48Pins
Supplier Device Package 48-QFP (12x12)
Number of I/Os 24I/Os
Memory Types Mask ROM
Data Converters A/D 2x8b
Series F2MC-8L MB89940
Packaging Tray
Operating Temperature -40°C~85°C TA
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Frequency 8MHz
Memory Size 16kB
Oscillator Type External
Speed 8MHz
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 3.5V~5.5V
Core Processor F2MC-8L
Peripherals LVD, LCD, POR, PWM, WDT
Program Memory Type Mask ROM
Core Size 8-Bit
Program Memory Size 16KB 16K x 8
RoHS Status ROHS3 Compliant
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MB89945PF-G-112-BND Documents

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