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S6E1A12B0AGN20000 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer Cypress
Factory Lead Time 23 Weeks
Package / Case 32-WFQFN Exposed Pad
Mounting Type Surface Mount
Number of I/Os 23I/Os
Data Converters A/D 5x12b
Series FM0+ S6E1A1
Published 2016
Packaging Tray
Operating Temperature -40°C~105°C TA
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Frequency 40MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Operating Supply Voltage 5.5V
Interface I2C, LIN, UART, USART
Memory Size 88kB
Oscillator Type Internal
RAM Size 6K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals DMA, LVD, POR, PWM, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 88KB 88K x 8
Connectivity CSIO, I2C, LINbus, UART/USART
Data Bus Width 32b
Core Architecture ARM
RoHS Status ROHS3 Compliant
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S6E1A12B0AGN20000 Documents

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