Bus IO-DF750-HT-003-11-1001A(H) Tech Specifications

Category Interface - I/O Expanders
Manufacturer DEGSON
Material PC+PA66
wiring PUSH-IN wiring technology
structure type Compact terminal module housing with signal LED
installation DIN35 rail
Side by side installation Dovetail groove clamping
label Laser screen printing
Ambient temperature (operation) -40℃~+70℃
Ambient temperature (storage/transportation) -40℃~+70℃
Strip length 8-9mm
Power contacts 2 blade contacts
Power load 10A
Cross section 0.2~2.5mm²
Connectable guide cross section AWG 28~12AWG
Packing unit 20 SKT
Products weight (without packaging) 122.5g
color C1 gray
Rated current Power: 24VBus connector: 5V
length 100mm
width 48mm
Height 69mm
PCB thickness 1.0mm
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