Diodes Incorporated BZX84C10S-7-F Zener Diode Arrays
200mW 10V 10V 200mW
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BZX84C10S-7-F Tech Specifications
| Category | Diodes - Zener - Arrays | |
| Manufacturer | Diodes | |
| Factory Lead Time | 23 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | |
| Number of Pins | 6Pins | |
| Weight | 6.010099mg | |
| Diode Element Material | SILICON | |
| Number of Elements | 2 Elements | |
| Operating Temperature | -65°C~150°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2007 | |
| Tolerance | ±6% | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.50 | |
| Power Rating | 200mW | |
| Voltage - Rated DC | 10V | |
| Max Power Dissipation | 200mW | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | BZX84C10S | |
| Pin Count | 6 | |
| Working Voltage | 7V | |
| Polarity | UNIDIRECTIONAL | |
| Configuration | 2 Independent | |
| Impedance | 20Ohm | |
| Diode Type | ZENER DIODE | |
| Current - Reverse Leakage @ Vr | 200nA @ 7V | |
| Power Dissipation | 200mW | |
| Voltage - Forward (Vf) (Max) @ If | 900mV @ 10mA | |
| Max Reverse Leakage Current | 200nA | |
| Impedance-Max | 20Ohm | |
| Test Current | 5mA | |
| Reference Voltage | 10V | |
| Forward Voltage | 900mV | |
| Zener Voltage | 10V | |
| Voltage Tol-Max | 6% | |
| Peak Reverse Current | 200nA | |
| Voltage Tolerance | 6% | |
| ESD Protection | No | |
| Zener Current | 200nA | |
| Height | 1mm | |
| Length | 2.2mm | |
| Width | 2.2mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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BZX84C10S-7-F Documents
Download datasheets and manufacturer documentation for BZX84C10S-7-F
- DatasheetsBZX84C2V4S - BZX84C39S
- Environmental InformationDiodes RoHS 3 Cert
- PCN Design/SpecificationGreen Encapsulate Change 09/July/2007 Bond Wire 11/Nov/2011
- PCN Assembly/OriginWafer Source 21/Apr/2017
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