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GBU406 Tech Specifications
| Category | Diodes - Bridge Rectifiers | |
| Manufacturer | Diodes | |
| Factory Lead Time | 9 Weeks | |
| Mount | Surface Mount, Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 4-SIP, GBU | |
| Number of Pins | 4Pins | |
| Weight | 3.404012g | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tube | |
| Published | 2006 | |
| JESD-609 Code | e3 | |
| Pbfree Code | no | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 4Terminations | |
| Termination | Through Hole | |
| ECCN Code | EAR99 | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | UL RECOGNIZED | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | GBU406 | |
| Pin Count | 4 | |
| Element Configuration | Single | |
| Diode Type | Single Phase | |
| Current - Reverse Leakage @ Vr | 5μA @ 600V | |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 2A | |
| Case Connection | ISOLATED | |
| Forward Current | 4A | |
| Max Surge Current | 150A | |
| Output Current-Max | 4A | |
| Forward Voltage | 1V | |
| Average Rectified Current | 4A | |
| Number of Phases | 1Phase | |
| Peak Reverse Current | 5μA | |
| Max Repetitive Reverse Voltage (Vrrm) | 600V | |
| Peak Non-Repetitive Surge Current | 150A | |
| Max Forward Surge Current (Ifsm) | 150A | |
| Reverse Voltage (DC) | 420V | |
| Height | 18.8mm | |
| Length | 22.3mm | |
| Width | 3.56mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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GBU406 Documents
Download datasheets and manufacturer documentation for GBU406
- Environmental InformationDiodes RoHS 3 Cert
- RohsStatementDiodes-Inc.-GBU406.pdf
- DatasheetsGBU406-Diodes-Inc.-datasheet-7549777.pdf GBU4005 - GBU410 GBU406-Diodes-Inc.-datasheet-11774300.pdf GBU406-Diodes-Inc.-datasheet-577527.pdf GBU406-Diodes-Inc.-datasheet-14050761.pdf
- PCN Assembly/OriginMult Dev Assembly/Wafer 20/Dec/2018
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