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SP8690A Tech Specifications

Category Logic - Signal Switches, Multiplexers, Decoders
Manufacturer Taiwan Semiconductor
Surface Mount NO
Material synthetic polyolefin
Number of Terminals 16Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS
Package Description DIP, DIP16,.3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Diameter of protected wire (cable) 12.8…24 mm
Diameter before shrink 26.0 mm
Diameter after shrink 12.5 mm
Wall thickness before shrink 0.55 mm
Wall thickness after shrink 0.9 mm
Gross weight 1725.00
Transport packaging size/quantity 46*46*24/10
Packaging coil 50 m
JESD-609 Code e0
Type Heat shrink tube without adhesive
Terminal Finish Tin/Lead (Sn/Pb)
Color blue
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-XDIP-T16
Qualification Status Not Qualified
Temperature Grade MILITARY
Operating temperature range -55…+125 °C
Logic IC Type PRESCALER
Power Supply Current-Max (ICC) 21 mA
Shrink temperature +70…+120 °C
Max Frequency@Nom-Sup 200000000 Hz
Operating voltage 600 V
Shrink Ratio 2:1
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SP8690A Documents

Download datasheets and manufacturer documentation for   SP8690A

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