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EMD3D256M16G2-150CBS1 Tech Specifications

Category Memory
Manufacturer Everspin Technologies
Surface Mount YES
Number of Terminals 96Terminals
Package Description TFBGA,
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Number of Words Code 16000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number EMD3D256M16G2-150CBS1
Number of Words 16777216 wordsWord
Supply Voltage-Nom (Vsup) 1.5 V
Package Code TFBGA
Package Shape RECTANGULAR
Manufacturer Everspin Technologies
Part Life Cycle Code Active
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC
Risk Rank 5.6
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B96
Supply Voltage-Max (Vsup) 1.575 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Operating Mode SYNCHRONOUS
Organization 16MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 268435456 bit
Memory IC Type MEMORY CIRCUIT
Width 10 mm
Length 13 mm
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