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EMD3D256M16G2-150CBS1R Tech Specifications

Category Memory
Manufacturer Everspin Technologies
Surface Mount YES
Number of Terminals 96Terminals
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC
Manufacturer Everspin Technologies
Manufacturer Part Number EMD3D256M16G2-150CBS1R
Number of Words 16777216 wordsWord
Number of Words Code 16000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Description TFBGA,
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Part Life Cycle Code Active
Reflow Temperature-Max (s) NOT SPECIFIED
Risk Rank 5.6
Rohs Code Yes
Supply Voltage-Nom (Vsup) 1.5 V
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B96
Supply Voltage-Max (Vsup) 1.575 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Operating Mode SYNCHRONOUS
Organization 16MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 268435456 bit
Memory IC Type MEMORY CIRCUIT
Length 13 mm
Width 10 mm
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