74LCX574WM Tech Specifications

Category Logic - Flip Flops
Manufacturer Fairchild
Mounting Type Through Hole
Package / Case 20-SOIC (0.295, 7.50mm Width)
Supplier Device Package 20-SOIC
Housing Material Polyamide (PA66), Nylon 6/6
Torque-Screw --
Current-UL 11A
Contact Materials Brass
Voltage-UL 300V
Current-IEC --
Package Bulk
Base Product Number 74LCX574
Mfr Fairchild Semiconductor
Product Status Active
Number of Elements 1 Element
Operating Temperature -40°C ~ 110°C
Series Termi-Blok, Buchanan
Packaging Bulk
Part Status Obsolete
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 16Positions
Color Blue
Pitch 0.138 (3.50mm)
Voltage - Supply 2V ~ 3.6V
Ingress Protection --
Insulation Height 0.362 (9.20mm)
Termination Style Solder
Function Standard
Output Type Tri-State, Non-Inverted
Contact Tail Length --
Number of Levels 1Level
Clock Frequency 150 MHz
Contact Mating Finish Tin
Wire Gauge or Range - AWG --
Current - Quiescent (Iq) 10 µA
Current - Output High, Low 24mA, 24mA
Positions Per Level 16
Plug Wire Entry --
Header Orientation Vertical
Wire Gauge or Range - mm² --
Wire Strip Length --
Screw Size --
Number of Bits per Element 8Bits per Elements
Max Propagation Delay @ V, Max CL 8.5ns @ 3.3V, 50pF
Trigger Type Positive Edge
Input Capacitance 7 pF
Features --
Material Flammability Rating UL94 V-0
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