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FDMM008G-CAB Tech Specifications

Category Memory
Manufacturer FLEx
Mounting Type Surface Mount
Surface Mount YES
Housing Material Liquid Crystal Polymer (LCP)
Number of Terminals 8Terminals
Number of Positions or Pins (Grid) 1944 (G34)
Contact Material - Mating Copper Alloy
Contact Material - Post --
Contact Finish Mating Gold
Package Style UNCASED CHIP
Number of Words Code 8G
Package Body Material UNSPECIFIED
Operating Temperature-Min 0
Operating Temperature-Max 70
Number of Words 8589934592Words
Package Code DIE
Package Shape RECTANGULAR
Package Description CARD-8
Manufacturer Part Number FDMM008G-CAB
Manufacturer Flexxon Pte Ltd
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FLEXXON GLOBAL LTD
Risk Rank 5.77
Operating Temperature --
Series --
Packaging Tray
Part Status Active
Termination Solder
Type LGA
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Current Rating 1A
Pitch - Mating 0.039 (1.00mm)
JESD-30 Code R-XUUC-N8
Contact Finish - Post --
Supply Voltage-Max (Vsup) 3.6
Contact Resistance --
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 8GX8
Memory Width 8
Memory Density 68719476736
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Termination Post Length --
Pitch - Post 0.039 (1.00mm)
Programming Voltage 2.7
Features Open Frame
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post --
Material Flammability Rating UL94 V-0
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