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FDMM016GBE-3101 Tech Specifications

Category Memory Cards
Manufacturer FLEx
Contact Plating Gold, Tin
Housing Material Polymer
PCB Mounting Orientation Vertical
Underplate Material Nickel
Circuit Applications Signal
Tail Length 1.4 mm
RoHS Non-Compliant
Shrouded Fully Shrouded
Package Tray
Base Product Number FDMM016
Mfr Flexxon Pte Ltd
Product Status Active
Memory Types microSD™
Operating Temperature -40°C ~ 85°C
Series FxAdv
Termination Press-Fit
Connector Type Plug
Number of Positions 96Positions
Max Operating Temperature 185 °C
Min Operating Temperature -67 °C
Number of Rows 12Rows
Pitch 1.905 mm
Technology TLC
Orientation Vertical
Current Rating 750 mA
Number of Contacts 96Contacts
Housing Color Black
Operating Supply Voltage 30 V
Contact Style Press-Fit
Row Spacing 1.35 mm
Max Current Rating 750 mA
Memory Size 16GB
Impedance 100 Ω
Speed UHS Class 1
Sealable No
Contact Current Rating 750 mA
Data Rate 25 Gbps
Number of Signal Positions 64Signal Positions
Hole Diameter 457.2 µm
Number of Columns 8Columns
Mating Alignment With
Stackable No
Make First / Break Last No
Differential Signaling Yes
Number of Pairs 32Pairs
Differential Pairs per Column 4
Number of Ground Positions 32Ground Positions
Width 20.8026 mm
Height 24.6126 mm
Length 23.0886 mm
Plating Thickness 760 nm
PCB Thickness 1 mm
Stack Height 11.95 mm
Flammability Rating UL94 V-0
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