FDMM032G-CAB Tech Specifications

Category Memory
Manufacturer FLEx
Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 8Terminals
Package Style UNCASED CHIP
Number of Words Code 32G
Package Body Material UNSPECIFIED
Operating Temperature-Min 0
Operating Temperature-Max 70
Number of Words 34359738368Words
Package Code DIE
Package Shape RECTANGULAR
Package Description CARD-8
Manufacturer Part Number FDMM032G-CAB
Manufacturer Flexxon Pte Ltd
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FLEXXON GLOBAL LTD
Risk Rank 5.78
Operating Temperature -55°C ~ 150°C
Series RNX
Packaging Bulk
Size / Dimension 0.140 Dia x 0.420 L (3.56mm x 10.67mm)
Tolerance ±10%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±200ppm/°C
Type NOR TYPE
Resistance 4.7 kOhms
Composition Metal Oxide Film
Power (Watts) 1W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N8
Failure Rate --
Supply Voltage-Max (Vsup) 3.6
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 32GX8
Memory Width 8
Memory Density 2.7487790694e+11
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Flame Retardant Coating, High Voltage, Safety
Height Seated (Max) --
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