FDMM032G-CAD Tech Specifications

Category Memory
Manufacturer FLEx
Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 8Terminals
Package Style UNCASED CHIP
Number of Words Code 32G
Package Body Material UNSPECIFIED
Operating Temperature-Min -25
Operating Temperature-Max 85
Number of Words 34359738368Words
Package Code DIE
Package Shape RECTANGULAR
Risk Rank 5.78
Ihs Manufacturer FLEXXON GLOBAL LTD
Part Life Cycle Code Contact Manufacturer
Manufacturer Flexxon Pte Ltd
Manufacturer Part Number FDMM032G-CAD
Package Description CARD-8
Operating Temperature -65°C ~ 175°C
Series Military, MIL-PRF-55182/07, RNC50
Packaging Bulk
Size / Dimension 0.070 Dia x 0.150 L (1.78mm x 3.81mm)
Tolerance ±0.1%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±50ppm/°C
Type NOR TYPE
Resistance 4 kOhms
Composition Metal Film
Power (Watts) 0.1W, 1/10W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N8
Failure Rate S (0.001%)
Supply Voltage-Max (Vsup) 3.6
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 32GX8
Memory Width 8
Memory Density 2.7487790694e+11
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Military, Moisture Resistant, Weldable
Height Seated (Max) --
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